09:00 
Opening
Andreas SCHULZE (imec)
 
09:10 
Keynote: Materials Innovation for Technology Scaling and the Implications to Metrology 
Zhiyong MA (Intel)
 
09:55 
Keynote: Metrology Challenges and Needs for Scaled 3D Devices and Architectures
Ajey JACOB (GlobalFoundries)
 
10:40 
Coffee Break
 
11:10 
Invited: Automated Nearline Process Control Workflows for 3D NAND and FinFET
Ozan UGURLU (Thermo Fisher Scientific)
 
11:45 
2D & 3D Advanced Transmission Electron Microscopy for Semiconductor Characterization 
Vincent DELAYE (LETI)
 
12:05 
Advanced Micro Probes for Semiconductor Metrology 
Andrea CASCI CECCACCI (Capres) 
 
12:25
Lunch 
 
13:30 
Invited: YieldStar Metrology System Applications for Advanced Process Control 
Paul HINNEN (ASML)
 
14:05
AFM-based Metrology for Advanced Patterning 
Alain MOUSSA (imec)
 
14:25
3DSEM Measurements of Stacked-NW Transistor Height Using New eTilt Metrology Algorithm 
Remi LE TIEC (AMAT) 
 
14:45 
Coffee Break 
 
15:15
Invited: Characterization Requirements of the CMOS Industry
Paul VAN DER HEIDE (imec)
 
15:50
Atom Probe Tomography Simulation of a Cross Section ABA Structure
David J. LARSON (Cameca)
 
16:10
Raman and Second-Harmonic Generation Spectroscopy For Probing The Orientation and Charge Density of MoS2
Vincent VANDALON (TU Eindhoven)
 
16:30
Reception